Diffuzionno-hardening solders based alloy gallium-indium-tin and powder of metal PCTSP5 reinforced with titanium

V.М. Skachkov, L.А. Pasechnik, О.V. Skachkova, S.P. Yatsenko
The Institute of Solid State Chemistry of the Ural Branch of RAS

DOI: 10.26456/pcascnn/2018.10.600

Abstract: The paper considers a new composition of diffusion-hardening solder based on a low-melting gallium alloy and copper-tin spherical powder (PCTSP5). The influence of the powder filler – titanium composition on the structure and properties of solder for expanding the areas of use is investigated. Strength properties, microstructure, thermal stability of the samples were studied.
Keywords: metal powder, composite diffusion-hardening alloys, solders, structure, properties, microhardness, differential thermal analysis.

Bibliography link:
Skachkov, V.М. Diffuzionno-hardening solders based alloy gallium-indium-tin and powder of metal PCTSP5 reinforced with titanium / V.М. et al. // Physical and chemical aspects of the study of clusters, nanostructures and nanomaterials: Interuniversity collection of proceedings / Ed. by V.M. Samsonov, N.Yu. Sdobnyakov. – Tver: TSU, 2018. – I. 10. – P. 600-608.

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