Physical and chemical aspects of the study of clusters, nanostructures and nanomaterials
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Study of properties of diffusion-hardening composite solder GaSn – CuSn – Mo

V.M. Skachkov, L.A. Pasechnik, S.P. Yatsenko

The Institute of Solid State Chemistry of the Ural Branch of RAS

DOI: 10.26456/pcascnn/2020.12.722

Original article

Abstract: The article discusses the possibility of regulating the properties of a diffusion-hardening solder based on a low-melting gallium-tin alloy and a solid component consisting of a copper-tin alloy powder by introducing an inert metal molybdenum powder and heat treatment. The microhardness and thermal stability of composite diffusion-hardening solders were evaluated. It is shown that repeated heat treatment at high temperatures contributes to the transition of the solder to an equilibrium state, with a sharp increase in hardness, almost by an order of magnitude. It is confirmed that inert fillers reduce the mechanical strength relative to the initial diffusion-hardening solder, even those that are well wetted with gallium, but there is a certain range containing a certain amount of the inert component, for molybdenum powder it is 15%, at which the microhardness of the composite solder reaches the maximum.

Keywords: composite diffusion-hardening solders, structure, properties, microhardness, differential thermal analysis

  • Vladimir M. Skachkov – Ph. D., Senior Researcher, Laboratory of Heterogeneous Processes, The Institute of Solid State Chemistry of the Ural Branch of RAS
  • Liliya A. Pasechnik – Ph. D., Leading Researcher, Laboratory of Heterogeneous Processes, The Institute of Solid State Chemistry of the Ural Branch of RAS
  • Sergey P. Yatsenko – Dr. Sc., Professor, Laboratory of Heterogeneous Processes, The Institute of Solid State Chemistry of the Ural Branch of RAS

Reference:

Skachkov, V.M. Study of properties of diffusion-hardening composite solder GaSn – CuSn – Mo / V.M. Skachkov, L.A. Pasechnik, S.P. Yatsenko // Physical and chemical aspects of the study of clusters, nanostructures and nanomaterials. — 2020. — I. 12. — P. 722-730. DOI: 10.26456/pcascnn/2020.12.722. (In Russian).

Full article (in Russian): download PDF file

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