Wetting of aluminum and copper substrates by lead – nickel melt
A.Kh. Shermetov1, A.A. Shokarov1, M.Kh. Ponezhev1, A.V. Sozaev2, B.S. Karamurzov1
1Kabardino-Balkarian State University named after H.M. Berbekov
2North Caucasian Institute of Mining and Metallurgy (State Technological University)
Abstract: In this paper, the task of obtaining new solders for brazing nickel and its alloys. Polyterms of wetting angle for Pb − Ni melts in the range from the melting point to 940 K on copper substrates and up to 900 K on aluminum were studied and wetting thresholds were detected: wetting of copper substrates starts at 640 K, and aluminum substrates are not wetted by the abovemelts.
Keywords: wetting angle, aluminum, nickel, copper, temperature of wetting threshold.
Shermetov, A.Kh. Wetting of aluminum and copper substrates by lead – nickel melt / A.Kh. Shermetov, A.A. Shokarov, M.Kh. Ponezhev et al. // Physical and chemical aspects of the study of clusters, nanostructures and nanomaterials: Interuniversity collection of proceedings / Ed. by V.M. Samsonov, N.Yu. Sdobnyakov. – Tver: TSU, 2018. – I. 10. – P. 671-676.
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