Electron microscopy of Cu − SiC composites: a cold-molding and solid phase sintering

N.A. Pan’kin, Vl.P. Mishkin
National Research N.P. Ogarev Mordovia State University

DOI: 10.26456/pcascnn/2018.10.517

Abstract: Cu − SiC composites were studied by scanning electron microscopy after processes of molding and a heat treatment. After pressing, plastic deformation of copper particles and traces of destruction of silicon carbide (cracks and debris) are observed. After the solid-phase sintering, formation of a porous structure in the matrix material is noted without significant changes in the filler particles. Data on the distribution of chemical elements near the SiC − Cu interface indicate an insignificant effect of diffusion processes.
Keywords: composite, electron microscopy, copper, silicon carbide, microstructure, pores.

Bibliography link:
Pan’kin, N.A. Electron microscopy of Cu − SiC composites: a cold-molding and solid phase sintering / N.A. Pan’kin, Vl.P. Mishkin // Physical and chemical aspects of the study of clusters, nanostructures and nanomaterials: Interuniversity collection of proceedings / Ed. by V.M. Samsonov, N.Yu. Sdobnyakov. – Tver: TSU, 2018. – I. 10. – P. 517-523.

Full text (in Russian): download PDF file