About «technological» properties of nano-sized nickel and copper films
D.V. Ivanov, A.S. Antonov, N.Yu. Sdobnyakov, H.N. Shimanskaya, E.V. Romanovskaia, M.S. Afanasiev
Tver State University
Belarusian State Technological University
MIREA – Russian Technological University
Fryazino Branch of V.A. Kotelnikov Institute of Radio Engineering and Electronics of Russian Academy of Sciences
Abstract: As an example of studying morphology of the relief of nickel and copper nano-sized films on the mica surface, it is possible to create a technology to «grow» structures with a given surface morphology using a scanning tunneling microscope. The characteristic features of the film surface nanorelief are described, including fractal properties. The current-voltage characteristics of a metal-to-metal contact for nickel and copper films with a tungsten tip are obtained. It is shown that for surface areas containing fractal structures, the current-voltage characteristics may differ from the dependences obtained on ordinary surfaces.
Keywords: scanning tunneling microscopy, nanorelief, fractal dimension, nanoscale films of nickel and copper, current-voltage characteristic, tunnel contact.
Ivanov, D.V. About «technological» properties of nano-sized nickel and copper films / D.V. Ivanov, A.S. Antonov, N.Yu. Sdobnyakov et al. // Physical and chemical aspects of the study of clusters, nanostructures and nanomaterials: Interuniversity collection of proceedings / Ed. by V.M. Samsonov, N.Yu. Sdobnyakov. – Tver: TSU, 2018. – I. 10. – P. 291-303.
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